MANHASSET, N.Y. — Sematech and Tokyo Ohka Kogyo Co. Ltd. (TOK), a leading manufacturer of photoresists, will team up to develop and demonstrate extreme UV materials and resists for use at the 22-nm node and beyond.
TOK joined Sematech's Resist Materials and Development Center (RMDC) at the College of Nanoscale Science and Engineering (CNSE) of the University at Albany, where the research will be conducted.
RMDC develops resist and materials for 22-nm and smaller patterning technologies. The work consists of both EUV exposure capability and a portfolio of sponsored university research programs.
"This new partnership is the latest example of Sematech's ongoing effort to create flexible participation options that will enable broader and deeper partnerships for advanced materials development," John Warlaumont, vice president of advanced technologies at Sematech, said in a statement.
Leading resist and materials suppliers working with the RMDC have access to Sematech's two micro-exposure tools as well as several metrology tools located at the University at Albany's College of Nanoscale Science and Engineering and University of California at Berkeley.
"Partnering with resist suppliers such as TOK will accelerate EUV resist development and, in turn, will support timely EUV [lithography] introduction," said Bryan Rice, director of lithography at Sematech.
Tokyo Ohka Kogyo is a manufacturer of photoresists for semiconductors and LCDs.
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