SAN JOSE, Calif. -- Ramtron International Corp., a supplier of nonvolatile ferroelectric random access memory (FRAM), has entered into a foundry services agreement with IBM Corp.'s Microelectronics Group.
Ramtron is in the process of establishing an $11.0 million loan facility through Silicon Valley Bank to fund the capital and development costs in connection with the foundry relationship with IBM.
Under the plan, the companies plan to install Ramtron's FRAM semiconductor process technology in IBM's Burlington, Vt.-based fab.
Ramtron (Colorado Spring, Colo.) expects to generate first production wafers during 2010 on the IBM's 0.18-micron wafer manufacturing process. IBM will become Ramtron's third foundry supplier for its FRAM semiconductor products, along with Fujitsu Ltd. and Texas Instruments Inc.
''The announcement today is a foundry agreement with IBM. IBM will provide foundry services for Ramtron. TI and Fujitsu provide foundry services for Ramtron too, but also have a license to use FRAM technology. IBM does not have a license to FRAM technology under this agreement. It is only for foundry services,'' according to a Ramtron spokesman.
Japan's Fujitsu is making 4-kilobit to 1-megabit FRAMs on a foundry basis for Ramtron. This represents most of Ramtron's production in terms of units.
TI is making 1-, 2- and 4-megabit FRAMs on a foundry basis for Ramtron. TI's FRAM process is based on a 130-nm technology.
With IBM, Ramtron will devise new products like RFID. ''We look forward to increased manufacturing capacity through our foundry relationship with IBM to help meet the growing demand for Ramtron's unique FRAM semiconductor products,'' said Bob Djokovich, Ramtron COO, in a statement.
In addition, Ramtron is working with Silicon Valley Bank to extend the company's revolving line of credit (LOC) until March of 2012, and increase the amount that can be borrowed under the LOC to a total of $5.0 million.
Ramtron's existing LOC allows for borrowings of up to $4.0 million. To date, Ramtron has no amount outstanding on its line of credit. The new loan facility is expected to close during the first quarter of 2009.
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