The development is targeting the foundry production of 28-nm logic ICs for Fujitsu by TSMC. The companies have already established a similar collaboration at 40-nm. Initial 28-nm samples are expected to ship toward the end of 2010.

The two companies are also discussing collaboration on advanced packaging.

Haruyoshi Yagi, corporate senior vice president of Fujitsu Microelectronics said the two companies are making progress at 40-nm with several product designs in progress. "With this further agreement with TSMC on 28nm high-performance process technology development and production, we combine both companies' strengths to create greater value for our customers, and will further drive the growth of businesses for TSMC and Fujitsu's ASIC and ASSP core products."

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