Latest News

Headlines for Tuesday, May 22, 2012

Technology

Video and audio storage requirements drive doubling of maximum hard drive densities by 2016

Next stop for SpaceX is space station

ST works with startup on 'permanent' in-ear audio

Indy electronics drive cars to be lighter, faster

Microsoft and Skolkovo Foundation cooperate on cloud

UK researchers follow silicon-oxide ReRAM route

Startup opens GaN-on-Si wafer production facility

Electronic components travel well on Space missions

Product

Agilent Technologies develops voice-over-LTE test system with Brüel & Kjær

MaxLinear tips front-end receivers for video gateways, STBs

Business

Jha out as Google closes Moto Mobility buy

Will Japan Inc. say sayonara to TV manufacturing?

Qualcomm offers $250,000 funding for best startup

China Mobile taps Mindspeed for femtocells

HDD densities expected to double by 2016

Headlines for Monday, May 21, 2012

Business

Handset shipments projected to rise 11% in 2012

SMSC investors sue to stop takeover by Microchip

Packaging materials firm snags $10.5M in funding

Foxconn to spend $210M on new Apple production plant

JEDEC publishes LPDDR3 standard for low-power memory devices

Report: Hynix, Globalfoundries in talks to buy Elpida

Silicon Labs to buy wireless mesh networking firm

Russia drives into U.S. fabless funding

ARM signs HiSilicon to use Mali GPU cores

Design

ON Semi expands Czech design center

Technology

Small basestations will be big

DO-178 software reuse in the ISO 26262 domain reduces cost for automotive suppliers

Inexact processor is more power efficient

IEEE group defines body area network

Extra!

Cadence CEO: EDA firms must innovate beyond software

Financial

Aquantia closes $35 million Series F funding round

Product

AMD plugs Trinity into embedded systems

Headlines for Sunday, May 20, 2012

Business

Facebook founder marries in secret ceremony

Headlines for Saturday, May 19, 2012

Technology

Ring of Fire: How Japan sees it (Updated)

Headlines for Friday, May 18, 2012

Business

Marvell sees return to normalcy following Thai floods

IHS: DRAM's share of smartphone BoM cut in half

Amkor plans back-end chip facility in South Korea

Report: ARM aims to take 20% of notebook PC market

ST sues InvenSense alleging patent infringement

Technology

Purdue researchers use AZO for optical metamaterials

NASA, SpaceX lower expectations for historic flight to space station

Living virus generates electricity

Samsung researchers propose graphene 'barristor'

Weightless standard for IoT outlined in book

Product

HiWave embeds haptic response in flat panels

Headlines for Thursday, May 17, 2012

Business

Applied sees flat to declining sales

Hybridization of processors increasingly rapidly, says report

MEMC's CFO resigns to take job at Praxair

Report: UMC benefits from TSMC 28-nm supply shortage

ESilicon set to reap rewards of Asian gamble

Taiwan expects 14% boost in IC output in Q2

Technology

NASA, commercial space industy brace for critical test

Electric Imp's cool versus Cambridge's Neul in IoT

Intel's FinFETs are less fin and more triangle

Financial

Foundry Tower piles up cash in Q1

Headlines for Wednesday, May 16, 2012

Conferences & Shows

Farnell element14 Cadsoft Eagle design contest opens

Business

Former Apple, Google, Facebook engineers launch IoT startup

GSA spies venture capital investment uptick in April

Extra!

Q&A: Nvidia’s Dally on 3-D ICs, China, cloud computing

Technology

OIF to define three 56 Gbits/s serial interfaces

Cadence tips faster Spice coming soon

UK opens Europe's largest robotics laboratory

Product

Altis foundry updates 130-nm specialty design kits

Cadence extends verification and storage IP offerings