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Rambus acquires SiP technology
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EE Times


SAN JOSE, Calif. -- Rambus Inc. has acquired a number of undisclosed patents from Inapac Technology Inc., a provider of system-in-package (SiP) technology.

These acquired patents are key enablers for SiP designs. SiP consists of a number of stacked integrated circuits (IC) -- such as a media processor, DRAM, and flash memory device -- enclosed in a single package or module.

These patents complement Rambus' Mobile Memory Initiative, announced earlier this year. Specific terms of the deal are not disclosed.

Rambus' Mobile Memory Initiative focuses on the development of high-performance, low-power memory solutions for smartphones, netbooks, portable gaming, and portable multimedia products. Rambus has demonstrated in silicon data rates of 4.3-Gbps. With this performance, designers could realize more than 17-gigabytes-per-second of memory bandwidth from a single mobile DRAM device.



Related Links:

  • Rambus demos mobile memory interface at DesignCon



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