Lattice offers auto-temp qualified chip scale 132 BGA packaging for XP2 family

SAN FRANCISCO—Lattice Semiconductor Corp. this week announced the availability of automotive temperature qualified (AEC-Q100) low-cost chip scale 132 ball grid array (BGA) packaging for the non-volatile LatticeXP2 FPGA family.

Based on Lattice's 90-nanometer hybrid flexiFlash technology, the XP2 family's new chip scale packaging enables realization of design requirements in the tightest form-factor automotive applications such as automotive camera modules, telematics systems, parking assistance systems and multimedia systems, according to Lattice (Hillsboro, Ore.).

The chip scale 132 BGA packaging has been qualified and characterized to meet AEC-Q100 requirements from the Automotive Electronics Council, and is available for the XP2-5 and XP2-8 devices, with 5,000 and 8,000 look-up tables (LUTs) available, respectively, Lattice said.

Measuring 64 square millimeters and 1.35 mm in height, the package footprint is the smallest available for non-volatile FPGAs, according to the company.

Production quantities of the new devices are available immediately, Lattice said. The company said it can provide standard production part approval process documentation to automotive customers. In 100,000-unit volume, the LA (Lattice Automotive) XP2-5 device is riced at $5.04, Lattice said.