News & Analysis
TI claims major femtocell design wins
John Walko
12/1/2008 11:59 AM EST
The company said it believes its processors are integrated into about 50 percent of the home basestations currently shipped across different standards and being trialed by mobile network operators in Europe, the U.S. and the Far East. These include Softbank, Verizon, AT&T and Vodafone.
"We have been very silent about our involvement with OEMs and success rate so far, and we still maintain that real volumes for chip makers and OEMs are some way off, in 2010 and beyond," Josef Alt, TI's communications infrastructure business development manager for Europe told EE Times Europe .
TI's roll call of customers is an impressive one, and includes Samsung, Huawei, Airvana, ZTE and Airhop.
Alt also revealed TI has joined the Femto Forum, becoming one of the few chip companies in the industry body promoting and supporting unified femto specifications and feeding into standards bodies such as the 3GPP. picoChip and RadioFrame were the only chip design and development related founding members of the organization in mid 2007, since when Lime Microsystems and Percello have also joined.
TI's decision should be a major bonus for the organization and its standardization efforts.
TI is pushing its DSP based approach, which Alt maintains offers a flexible, cost effective and programmable solution, "which gives us a founding for future optimized and tightly integrated solutions once the standards are bedded down and volumes begin to accelerate.
“The business is not yet ready for a hard-coded, optimized solution, so making use of existing proven products, such as our C6x+ based platform, used by the biggest players in the wireless infrastructure business, makes sense."
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Next:
TI's DSP offering
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