Cadence teams to offer product life cycle management bundle

Cadence teams to offer product life cycle management bundle
SAN MATEO, Calif. — Cadence Design Systems, MatrixOne and IBM Corp. said Wednesday (May 21) they are joining forces under an arrangement that allows Cadence and MatrixOne to co-develop new software that will be provided to their customers as a suite of product lifecycle management (PLM) solutions.

Cadence will provide design management tools from its former Spin Circuit spin off and from its acquisition of the Thales Group. Matrix Group will provide design data management, change management and collaboration technologies. IBM will provide middleware for the bundle.

In addition, Cadence is working with MatrixOne to integrate MatrixOne technology into new offerings, including a collaborative design and library management tool that integrates collaborative tools directly onto the electronic designer's desktop. The companies said their new solution would allow engineering design teams to perform a combination of tasks that previously lacked a practical commercial solution.

They also said the new solution will offer: work-in- progress design data management; collaboration between design, sourcing, and manufacturing; component and design library management; enterprise-wide library distribution; secure, automated design-to-manufacturing hand-off; comprehensive bill of material (BOM) management and optimization; and integration with corporate PLM environments.

The new technology and bundle will be sold through Cadence's sales channel.

In addition the companies also plan on jointly marketing existing tools that make up the PLM bundle. The solutions, said the companies, will enable electronics companies to synchronize the three primary development processes: electronics design, embedded software development and mechanical design, in a single environment.

The companies said the products would enable collaborative design directly from the engineering desktop; synchronize activities across software, electronics and mechanical design disciplines; and optimize interactions among OEMs, semiconductor companies and electronic manufacturing services providers.

IBM will offer integration services and its IBM WebSphere and DB2 middleware products for mutual customers.