News & Analysis
Custom Circuits
5/13/2002 10:25 AM EDT
Custom Circuits
Ac scheme bumps I/O density
MOSFET design simplifies DRAM
Flexible I/O speeds data switch
Field programmable mixed-signal SoC offer more levels of integration
Vector architecture optimized for DSP imaging/wireless apps
Reconfigurable processor combines extensible core with SRAM-based FPGA
600-MHz DSP handles more channels, prepped for 3G basestations
In-P HBTs fill high- speed, low power optical tranceiver requirements
Adaptive approach needed for 10 Gbit/s backplanes
![]()
Innovative ideas leap design hurdles at CICC
The IEEE Custom Integrated Circuits Conference (CICC) has been the prime venue for new
perspectives on the toughest problems facing IC designers. This year's event, to be
held this week in Orlando, Fla., offers a fresh crop of innovative circuit design ideas,
some of which are excerpted in this week's Focus section.
![]()
![]()
Navigate to related information



