Lithography firms woo chip makers for new tool efforts; Intel joins Japanese EUV group

At the same time the Japanese consortium ASET (Association of Super-Advanced Electronic Technology) has added Intel Corp. to its efforts to develop Extreme Ultraviolet (EUV) lithography. ASET also expects Samsung Electronics Co. Ltd. and Canon Inc. to join the efforts as well. The Japanese group is also soliciting other new chip makers in its race with the U.S. Extreme Ultraviolet LLC consortium, which has the backing of Intel, Motorola, Advanced Micro Devices, and the U.S. Department of Energy national laboratories.

The campaign to line up semiconductor manufacturers behind new lithography developments heated up at the Semicon West show in San Francisco this week. Sources said the groups hope to set new alliances with chip makers for the early development of lithography tools and to build support for the new technologies. In addition, ASML and ASET also would like to get some new financial help as well.

Doug Dunn, president and chief executive officer of ASML, told SBN that the Dutch lithography supplier is signing up semiconductor companies to participate closely in developing of 157-nm systems. "We hope to announce some names shortly," he said.

"This will give us early inputs and feedback from customers as we perfect the new technology," said the ASML chief executive. "Hopefully, it will also build support for initial orders for equipment," he added.

Dunn ASML would welcome chip company investments in the 157-nm tool development, but he didn't say if financial participation was required in the new alliance.

He said the 157-nm customer cooperation would be similar to customer support for ASML's other alliance with Applied Materials Inc., which is working with the Dutch company to develop an electron-beam projection lithography (EPL) tool. ASML and Applied have formed eLith LLC, based in New Providence, N.J., which is also a candidate to accept new corporate members.

Dunn said ASML's roadmap calls for the initial 157-nm prototype to be ready at the end of 2003. ASML is courting chip firms to join with its 157-nm tool program just as a rival, Silicon Valley Group Inc., is in final negotiations to sign an order for its prototype 157-nm system with a firm in Taiwan in the heart of ASML's major market, according to sources at Semicon West.

An official with SVG's lithography division said the firm won't comment on speculative reports.

The Japanese ASET consortium is also seeking new chip company and equipment supplier members in its EUV development. Shinji Okazaki, associate director for ASET EUV Laboratory, said the new companies could join as the consortium's EUV program moves into its second phase next year.

He said Intel joined the ASET project earlier this year. He didn't think this was surprising, even though the U.S. firm is the driving force behind EUV LLC, the American consortium spearheading development of the next generation system. "It is good to have some connection between the two groups developing this new technology," he added.

Okazaki made clear that "a firewall" exists to prevent exchange of any data from the U.S. group that came from the Department of Energy national laboratories working with EUV LLC. Congressional critics have complained about ASML participation in the U.S. EUV project, and lately by Infineon Technologies AG of Germany joining the effort (see June 2 story).

Canon in Japan will also join the ASET EUV program, said Naoki Ayata, vice president and general manager of Canon USA Semiconductor Equipment Division. He said Canon has several patents on EUV, and believes the firm can contribute to the next generation system.