U.S. startup FlexICs opens pilot fab for plastic ICs

The Silicon Valley startup said it has developed an ultra-low temperature semiconductor process to fabricate ICs on plastic. The technology produces circuits with temperatures less than 100 degrees C, said the year-old company.

Several proprietary techniques have been developed for high-performance gate dielectrics at low temperature and photolithography on flexible substrates, according to FlexICs. The company believes its technology will make possible intelligent, rugged electronic circuitry as well as thin, shatterproof and flexible displays. The plastic-based ICs will be aimed at portable systems, memory modules, optical component integration, and imaging applications.

"The opening of our fabrication facility is an important milestone for the commercialization of our semiconductor-on-plastic technology and takes advantage of the rapid adoption of portable electronics in our daily lives," said Magnus Ryde, chairman and CEO of the startup. "Our technology will enable these products to be lighter, more durable, and thinner."

FlexICs said its pilot production facility has 18,000 square feet of space with a Class 100 clean room that's equipped with special tools for making semiconductors on plastic at low temperatures.