OSE, Winstek form IC-testing partnership

The partnership provides OSE with chip-testing capacity and services. As part of this partnership, OSE and Winstek have agreed to jointly run their materials and information management, process integration, and logistics services to shorten cycle times.

Winstek specializes in testing "chip sets, PC chip sets and high-frequency wireless communication chips that are packaged using high-end PBGA and flip chip technology," said Winstek president Richard Weng, in a statement.

In 2001, Singapore's ST Assembly Test Services Ltd. announced plans to acquire a 51 percent stake in Winstek of Hsinchu (see July 31, 2001 story ).

It will provide test capacity for OSE of Kaohsiung. "OSE's focus is on high-level R&D for PBGA and flip-chip technologies, specializing in packaging of high-end chip sets and high-end graphic chip sets in particular," said Edward Duh, president of OSE, in a statement.

"The cooperation between us focuses on how each company can complement the other in the areas of capacity, and testing technology," he said.

Since 2002, OSE has made continuous adjustments to its operations strategy, emphasizing the development of profitable markets for its products and services. The company is actively pursuing single-in-line packages and multi-chip modules (MCMs).

The company is also downsizing its operations. OSE announced plans to shut down its U.S. manufacturing facilities (see April 21 story ).