News & Analysis
Toshiba samples 64-Gbyte NAND module
Peter Clarke
12/15/2009 5:44 AM EST
The module comprises sixteen pieces of 32-Gbit NAND flash memory ICs fabricated in a 32-nm manufacturing process plus a data controller IC. The chips are thinned to 30-micrometers.
"The e-MMC interface has become the most widely embraced embedded NAND solution with a built-in controller to simplify integration into system designs. With the addition of higher density, Ver 4.4 e-MMC compliant product offered as single package solutions or as part of a multi-chip module combined with DRAM, Toshiba can help designers reduce memory subsystem space requirements," said Scott Beekman, business development manager, mobile communications memory for Toshiba America Electronic Components Inc., in a statement.
Related links and articles:
Samsung ramps production of 30-nm NAND memory
Numonyx 1-Gbit phase-change memory set to sample in Q1
Apple accused of NAND price manipulation



