News & Analysis

Design Tools

12/8/2003 4:45 PM EST

Design Tools


Tools address the whole package
As IC speeds continue to climb well into the gigahertz range, system designers are finding that the new obstacles they must overcome to interconnect ICs to packages and packages to printed-circuit boards are blocking their ability to fully utilize these increases in chip speed.


  • Passive integration activates wireless
  • Start thinking out of known 'design box'
  • Co-design strategies tame PC system bus
  • Methodology enshrines IC, package and pcb
  • Speedy FPGAs need IC/package co-design


  • Unified data model brings signal integrity
  • Concurrent FPGA/board co-design ties in
  • Signal integrity key for Gbit interconnects





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