News & Analysis

MEMS

10/3/2003 3:31 PM EDT

MEMS


MEMS integration issues debated
High on the list of obstacles slowing the proliferation of silicon micromachines is the task of integrating the sensors of microelectromechanical systems with signal-conditioning circuitry on the same CMOS chip. When Roger Grace, president of the Micro and Nanotechnology Commercialization Education Foundation and president of Roger Grace Associates (Naples, Fla.), called this phenomenon to our attention, the theme of this InFocus section was established.


  • Performance grows with integration
  • MEMS integration carries advantages, risks
  • For mixed-signal, roll multiple MEMS dice
  • Optical switch benefits from off-chip drive
  • Weighing packaging solutions


  • Volatility beta guides MEMS investments
  • MEMS-IC integration remains a challenge





  • Please sign in to post comment

    Navigate to related information

    EE Buzz DesignCon

    Datasheets.com Parts Search

    185 million searchable parts
    (please enter a part number or hit search to begin)

    Feedback Form