News & Analysis
Packaging Issues
8/26/2002 10:17 AM EDT
Packaging Issues
CAD tackles package parasitics
BGAs jump speed/density barrier
RF system-in-package competes with SoCs
QFN packages quell noise, cost, space in handhelds
IC packaging raises modeling, layout concerns in communications design
IC packaging, typically an afterthought in the design of a new-generation SoC, is particularly troublesome for communications circuits and high-speed interface circuits.
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