Tech Papers
This paper evaluates common misconceptions about the use of via-in-pad as a viable design technique. It takes the perspective that via-in-pad is a design tool that can be used correctly or incorrectly, and shows examples of both good and bad design.
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BWatson
7/28/2010 8:22 AM EDT
Even though I started laying out boards when tape and mylar was the in vogue, I have not been exposed to the term "via-in-pad." So the paper would have meant more to me if it began by defining the topic.
Sincerely,
Bob Watson, N.C.E.
Southern Technologies Corp
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Sensorguy_0623
7/28/2010 11:29 AM EDT
Good article. Via-in-pad solutions will increase the cost of the board. In many cases, the ability to reduce the size of the board because of the higher density could make cost a wash since if you are forced to use the techniques for the BGA, carrying it across to other components comes at minimal cost.
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Davepcb
8/25/2010 12:06 PM EDT
The technology is not new, it has been around for 15+ years but not common for the PCB fab houses. As parts get smaller and the fab houses get the via fill technology standardized it will be necessary to use these once advanced techniques to get boards done at all. It may reduce size and layers using this technique and designing using 4 mil line space.
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MrPWM
8/27/2010 2:15 PM EDT
Cooties?? OMG, help! Noooooooooo
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charly5139
9/29/2010 8:38 AM EDT
With 0.4mm pitch, it's still possible to have ONE trace routed between the zig-zag balls if you use 3mil traces. I strongly agree to use "closed" vias only.
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