Tech Papers
Substrate coupling analysis has recently become both an intensive research topic and emerging commercial EDA demand in mixed-signal and RF applications. The traditionally assumed insulation between devices, because of high resistivity and carefully designed junctions, is disappearing to a point where coupling between devices should be carefully analyzed. Degradation of noise characteristics in RF circuits due to such coupling and susceptibility of analog circuits to wide-range swings of digital signals are the main concerns.
Rate this Content
|
|
|
|
|
Navigate to related information
