FTTP CPE Components—The Current and Future View

This article reviews the architecture and components of the triple-play CPE required by the recent FTTP (Fiber To The Premises) RFP in the U.S. market. The current architecture and components available meet the functionality and performance requirements but are not low enough in cost for Contract Manufacturers. The current high cost is the major barrier for mass deployment. The evolution of new optics technologies and the ability to integrate more functionality into a single IC, both for digital and analog needs, will enable a decrease in BOM (Bill of Materials) costs as well as reduce the assembly efforts. Most importantly, it will shorten the food chain by eliminating the need for a transceiver manufacturer.