Tech Papers
This paper discusses two major subjects: the qualification of die attach in stacked die structures and compact thermal modeling. An overview of the current techniques for die attach qualification in stacked structures for failure analysis is given. Finally, the state-of-the-art and the major issues in compact thermal modeling of stacked die packages is presented.
Note: By clicking on the above link, this paper will be emailed to your TechOnline log-in address by Mentor Graphics.
Rate this Content
|
|
|
|
|
Navigate to related information
