Tech Papers
Thermal Measurement and Modeling of Multi-Die Packages
Mentor Graphics
Mentor Graphics Technical Library
July 2009
The paper gives an overview of thermal measurement and modeling techniques and results for stacked and MCM structures. Results for an opto-coupler device with 4 chips mounted in a combined lateral and vertical arrangement are presented. The paper also shows how to derive junction-to-pin thermal resistances directly from transient measurement results using structure functions.
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