Tech Papers
Process Window OPC for Reduced Process Variability and Enhanced Yield
Mentor Graphics, IBM
Mohamed Al-Imam and Hesham Maaty, Azalia Krasnoperova1, James A. Culp, Ioana Graur, and Scott MansfieldMentor Graphics Technical Library
May 2006
In this paper, a Process Window OPC (PWOPC) concept is discussed, along with its place in the design-to manufacturing flow. Use of additional models for process corners, integration of process fails and algorithm optimization for a production-worthy flow are described. Results are presented for 65nm metal levels.
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