Designing an RF System-In-Package with Improved IC Design Environment

The complete ST SIP RF platform provides a full design environment with several different ST technologies: IC, IPAD, external filters, Surface Mounted Technologies (SMT), and passives embedded in laminate (BGA). ST is facing a number of design challenges in the package for RF (Radio Frequency), such as expertise on new technologies, assembly rules and model library for SMT, and design rules for embedded passives. Before developing a complete RF design environment for this new technology, it is necessary to ask: Who should be the SIP designer? Which tools should we use? This paper describes the solutions found at ST in order to reach a complete production RF SIP flow.