Thermal Considerations for TMS320DM64xx, TMS320DM64x, and TMS320C6000 Devices

As integrated circuit (IC) components become more complex, the challenge of producing an end product with superior thermal performance increases. Thermal performance is a system-level concern, impacted by IC packaging as well as by printed circuit board (PCB) design. This application report addresses the thermal considerations for the TMS320DM64xx, TMS320DM64x, and TMS320C6000 digital signal processing (DSP) devices.