Progress in Electronic Packaging: From HMC to SOP

The art of electronic packaging is being integrated into the monolithic and hybrid integrated circuit (IC) and printed circuit board (PCB) card manufacturing and is heading towards system-on-a-chip (SoC) and/or system-on-a-package (SOP) technologies.

This paper traces the course of this progression, from the beginnings of electronics packaging technology in the nineteen-fifties to its present state, and discusses the direction in which it the technology is ultimately headed.