Signal Integrity (SI) Process for High-Speed (HS) Mixed Signal Analysis

This white paper describes the Signal Integrity (SI) process, a numerical analysis investigation of defined electronic system specifications, conducted either at the pre-design stage or at the post-printed circuit board (PCB) layout stage. The main objectives of the SI process are to shorten the system design time and to eliminate the need for trial-and-error methods. The principal result is a clear electronic signal path from the source integrated circuit (IC) to the target IC, within a silicon technology threshold.