Design Article

Adapt standard tests to non-standard devices: Automotive qualification of a MEMS-based sensor system

David Petry, ZMD America and Chris Ranwell, GE Sensing & Inspection Technologies

12/11/2008 4:04 AM EST

This article describes the technical challenges related to automotive electronics qualification and verification of a MEMS-based sensor and ASIC system. The example device is a system-on-chip, fully calibrated, surface mount IC, which comes in one of three humidity outputs, digital, ratiometric, or linear (0-1V).

Testing results presented will focus on application of the following tests:

  • Temperature-humidity bias life
  • Temperature cycling
  • High-temperature operating life
  • Early-life failure rate
  • ESD Human Body Model
  • ESD Charged Device Model
  • Latch-up
  • Characterization
  • Solderability
  • Electrical transients
  • Wire bond pull testing (both encapsulated and unencapsulated).

    This feature shows how to adapt industry standard tests to a non-standard device, resulting in an assessment of the robustness of a MEMS-based sensor system.

    Topics covered include:

  • Criteria for evaluating the quality and reliability of a MEMS-based temperature and humidity sensor to ensure reliable performance in automotive applications.
  • Assessment of electrical and environmental tests and requirements as they apply to dual silicon temperature and humidity devices.
  • Review of MEMS system qualification results, reliability assessments, and test results.

    Qualification challenge
    The first natural step in designing the qualification plan for MEMS-based sensor and ASIC chip systems would be to review AEC-Q100 for the traditional automotive requirements. AEC-Q100 or "Stress Test Qualification for Integrated Circuits" is maintained by the Component Technical Committee of the Automotive Electronics Council (AEC). However, it's clear that AEC-Q100 does not have specific requirements for MEMS devices and does not address unencapsulated devices. This is where the engineer designing the test plan must get creative in seeking a solid physics of failure-based test regime.

    Overview of circuit function
    The ChipCap series humidity sensor by GE offers a new standard in the field of accurate relative humidity measurement. Based on a capacitive polymer sensing technology, this device offers signal conditioning and temperature compensation for a single system-on-chip (SoC) device. Its measurement capability is accurate to ±2% from 20 to 80% relative humidity (RH) and ±3% across the entire humidity range at 25C. The temperature accuracy is ±1C from 0 to 70C. ChipCap provides either analog or digital interfaces in a single, 5-VDC-powered chip. Dual outputs furnish humidity and temperature as linear (0 to 1V), ratiometric (10-90% of VDD), or with digital output (ZACwire one-wire interface).

    ChipCap relative humidity sensors change capacitance in direct proportion to ambient relative humidity. An internal solid state band gap provides the temperature output measurement. The ChipCap 14-pin SOIC-packaged MEMS sensor and ASIC is shown below.

    Device specifications

  • Relative Humidity
    RH Sensor: Planar Capacitive Polymer
    RH Range: 0 to 100% RH
    RH Accuracy @ 25C: ±2% from 20 to 80%; ±3% from 0 to 20% and 80 to 100%
    RH Resolution: 0.4% RH

  • Temperature
    Temperature Sensor: Integral band gap PTAT
    Temperature Scale: "55 to 150C
    Temperature Accuracy: ±0.6C at 25C
    Temperature Resolution: 0.2C

  • Environmental
    Storage Temperature: "55 to 150C
    Operating Temperature: "40 to 85C
    Operating RH Range: 0 to 100% RH, non-condensing




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